Adhesion Aspects of Thin Films by Kash L. Mittal

By Kash L. Mittal

A moment overseas symposium on adhesion facets of skinny motion pictures, held in Orlando, Florida in December 2003, improved from the 1st by way of contemplating metalized plastics and adhesion size. The 17 papers that caught to the publishing procedure transparent to the tip think about such themes as adhesion houses of functionally gradient diamond- like carbon nano-composite motion pictures, characterizing polyethylene-metal composite skinny motion pictures deposited via evaporation, the contribution of chemical reactions among aluminum atoms and varieties of practical teams to the adhesion of aluminum-polymer platforms, and serious occasions saw on copper motion pictures on glass substrate within the micro-scratch try out. there's no index. VSP is a subsidiary of Brill.

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26, 765-770 (2003). 8. J. A. J. V. Swain, Suvface Coatings Technol. 192, 354364 (2005). 9. A. Latella, G. Triani, Z. T. R. Bartlett, Thin Solid Films (Submitted). 10. M. Ignat, Key Eng. Mater. 116-117, 279-290 (1996). 11. P. Scafidi and M. Ignat, J. Adhesion Sei. Technol. 12, 1219-1242 (1998). 12. E. Harry, A. Rouzaud, M. Ignat and P. Juliet, Thin SolidFilms 332, 195-201 (1998). Adhesion Aspects ofThin Films, Vol. 3, pp. 59-70 Ed. L. -D. KAMMINGA,' P. van ESSEN,' S. YU. GRACHEV,' R. HOY' and G.

Ramsier, G. A. Dagata, J. Vuc. Sci. Technol. A21, 1188-1193 (2003). 26. W. Y. H. Li and K. Li, Thin Solid Films 335,220-224 (1998). Adhesion Aspects of Thin Films, Vol. 3 , pp. 47-57 Ed. L. Mittal C VSP 2007 Fracture and adhesion of thin films on ductile substrates B. A. LATELLA,”* M. IGNAT,2G. TRIANI,’ D. J. CASSIDY’ and J. R. , BP 75, F-38402 Saint Martin d’Hkres, France Abstract-A simple tensile test procedure has been used to investigate the fracture and adhesion behaviour of sol-gel-derived silica and atomic layer deposited titania and alumina thin films on metallic and polymeric substrates.

2d [SI, but is modified partly by the thermal oxide layer. There is extensive transverse cracking within the thermal oxide layer and some small, mainly parallel cracks that traverse the thermal oxide into the covering GTMS layer are seen in the higher magnification image (Fig. 3b). As a consequence of the cracking in the brittle thermal oxide layer, the reliability of the solgel layer is somewhat compromised and may result in a loss of adhesion. The indentation behaviour of the coatings from nano-indentation [8] showed a similar trend as a result of the addition of organic substituents to the inorganic sol-gel network.

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